Multichip modules: systems advantages, major constructions, and materials technologies /
Multichip modules: systems advantages, major constructions, and materials technologies /
R. Wayne Johnson, Robert K.F. Teng and John W. Balde.
- New York: IEEE Press, 1991
- ix, 603 p. : ill. ; 29 cm.
- A volume in the IEEE Press selected reprint series .
Includes bibliographical references and indexes.
0-87942-267-X
90020827
Electronic packaging.
Microelectronic packaging.
Multichip modules (Microelectronics)
TK7870.15 / .M85 1991
Includes bibliographical references and indexes.
0-87942-267-X
90020827
Electronic packaging.
Microelectronic packaging.
Multichip modules (Microelectronics)
TK7870.15 / .M85 1991