Wire bonding in microelectronics: materials, processes, reliability, and yield / George G. Harmon.
Material type:
TextSeries: Electronic packaging and interconnection seriesPublication details: New York: McGraw-Hill, 1997Edition: 2nd edDescription: xiv, 290 p. : ill. ; 24 cmISBN: - 0070326193
- TK7836 .H37 1997
| Item type | Current library | Collection | Call number | Copy number | Status | Date due | Barcode | |
|---|---|---|---|---|---|---|---|---|
Books
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Informatics and Virtual Education Library Collection General Collection | Non-fiction | TK7836 .H37 1997 (Browse shelf(Opens below)) | C.1 | Available | 1413 |
Browsing Informatics and Virtual Education Library Collection shelves, Shelving location: General Collection, Collection: Non-fiction Close shelf browser (Hides shelf browser)
| TK 7836 .D35 1990 ESD program management : a realistic approach to continuous, measurable improvement in static control / | TK 7836 E39 1991 Manufacturing technology in the electronics industry: an introduction/ | TK 7836 .H36 1997 Handbook of microlithography, micromachining, and microfabrication/ | TK7836 .H37 1997 Wire bonding in microelectronics: materials, processes, reliability, and yield / | TK7836 .M65 1995 Solving interference problems in electronics/ | TK 7836 .P38 1990 Computer vision for electronics manufacturing/ | TK 7836 .S48 1991 Concurrent engineering and design for manufacture of electronics products/ |
Includes bibliographical references and index.
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