TY  - BOOK
AU  - Harman,George G.
AU  - Harman,George G.
TI  - Wire bonding in microelectronics: materials, processes, reliability, and yield 
SN  - 0070326193 (recycled, acidfree paper)
AV  - TK7836 .H366 1997
U1  - 621.3815 21
PY  - 1997///
CY  - New York
PB  - McGraw-Hill
KW  - Wire bonding (Electronic packaging)
KW  - Production control
KW  - Electronic packaging
KW  - Reliability
KW  - Defects
KW  - Semiconductors
KW  - Failures
N1  - Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989; Includes bibliographical references and index
UR  - http://www.loc.gov/catdir/description/mh023/97019652.html
UR  - http://www.loc.gov/catdir/toc/mh022/97019652.html
ER  -