TY  - BOOK
AU  - Pecht,Michael G.
TI  - Soldering processes and equipment
SN  - 0-471-59167-X 
AV  - TK7870.15 .S65 1993
PY  - 1993///
CY  - New York
PB  -  J. Wiley
KW  - Electronic packaging
KW  - Materials
KW  - Solder and soldering
KW  - Surface mount technology
N1  - Includes bibliographical references and index
ER  -