Wire bonding in microelectronics: materials, processes, reliability, and yield / George G. Harmon.
Material type: TextSeries: Electronic packaging and interconnection seriesPublication details: New York: McGraw-Hill, 1997Edition: 2nd edDescription: xiv, 290 p. : ill. ; 24 cmISBN:- 0070326193
- TK7836 .H37 1997
Item type | Current library | Collection | Call number | Copy number | Status | Date due | Barcode | |
---|---|---|---|---|---|---|---|---|
Books | Informatics and Virtual Education Library Collection General Collection | Non-fiction | TK7836 .H37 1997 (Browse shelf(Opens below)) | C.1 | Available | 1413 |
Includes bibliographical references and index.
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