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1.
Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon. by Series: Electronic packaging and interconnection series
Edition: 2nd ed.
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New York : McGraw-Hill, c1997
Online access:
Availability: Items available for loan: Informatics and Virtual Education Library Collection (1)Call number: TK7836 .H366 1997.

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2.
The Microsoft data warehouse toolkit : with SQL Server 2005 and the Microsoft Business Intelligence toolset / Joy Mundy and Warren Thornthwaite with Ralph Kimball. by
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: Indianapolis, IN : Wiley Pub., c2006
Online access:
Availability: Items available for loan: Informatics and Virtual Education Library Collection (1)Call number: QA76.9.D37 M95 2006.

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