Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon.
Material type: TextSeries: Electronic packaging and interconnection seriesPublication details: New York : McGraw-Hill, c1997.Edition: 2nd edDescription: xiv, 290 p. : ill. ; 24 cmISBN:- 0070326193 (recycled, acidfree paper)
- 621.3815 21
- TK7836 .H366 1997
Item type | Current library | Call number | Status | Date due | Barcode | |
---|---|---|---|---|---|---|
Books | Informatics and Virtual Education Library Collection General Collection | TK7836 .H366 1997 (Browse shelf(Opens below)) | Available | 1413 |
Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.
Includes bibliographical references and index.
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