Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon.

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TextSeries: Electronic packaging and interconnection seriesPublication details: New York : McGraw-Hill, c1997.Edition: 2nd edDescription: xiv, 290 p. : ill. ; 24 cmISBN:

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Holdings
Item type	Current library	Call number	Status	Date due	Barcode
Books	Informatics and Virtual Education Library Collection General Collection	TK7836 .H366 1997 (Browse shelf(Opens below))	Available		1413

Rev. ed. of: Reliability and yield problems of wire bonding in microelectronics. 1989.

Includes bibliographical references and index.

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