| 000 | 00804cam a2200205 a 4500 | ||
|---|---|---|---|
| 008 | 971006s1998 nyua b 001 0 eng d | ||
| 020 | _a0070228949 | ||
| 050 | 0 | 4 |
_aTK7874 _b.G37 1998 |
| 100 | 1 |
_aGarrou, Philip E. _93314 |
|
| 245 | 1 | 0 |
_aMultichip module technology handbook / _cPhilip E. Garrou and Iwona Turlik. |
| 260 |
_aNew York: _bMcGraw-Hill, _c1998 |
||
| 300 |
_a(xxii, various pagination): _bill. ; _c25 cm |
||
| 440 | 0 |
_aElectronic packaging and interconnection series _93315 |
|
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 |
_aMultichip modules (Microelectronics) _93316 |
|
| 650 | 0 |
_aMicroelectronic packaging. _93317 |
|
| 650 | 0 |
_aIntegrated circuits _xVery large scale integration _xDesign and construction. _93318 |
|
| 700 | 1 |
_aTurlik, Iwona. _93319 |
|
| 942 |
_2lcc _cBK |
||
| 999 |
_c4423 _d4423 |
||