| 000 | 00689pam a2200217 a 4500 | ||
|---|---|---|---|
| 001 | 3924259 | ||
| 005 | 20240805084603.0 | ||
| 008 | 920918s1993 nyua b 001 0 eng | ||
| 010 | _a 92033770 | ||
| 020 | _a0-471-59167-X | ||
| 050 | 0 | 0 |
_aTK7870.15 _b.S65 1993 |
| 245 | 0 | 0 |
_aSoldering processes and equipment / _cMichael G. Pecht. |
| 260 |
_aNew York: _b J. Wiley, _c1993 |
||
| 300 |
_axiv, 296 p. : _bill. ; _c24 cm. |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 |
_aElectronic packaging _xMaterials. _914617 |
|
| 650 | 0 |
_aSolder and soldering. _914618 |
|
| 650 | 0 |
_aSurface mount technology. _96436 |
|
| 700 | 1 |
_aPecht, Michael G. _96816 |
|
| 942 |
_2lcc _cBK |
||
| 999 |
_c7987 _d7987 |
||