Multichip modules: systems advantages, major constructions, and materials technologies / R. Wayne Johnson, Robert K.F. Teng and John W. Balde.
Material type: TextSeries: A volume in the IEEE Press selected reprint seriesPublication details: New York: IEEE Press, 1991Description: ix, 603 p. : ill. ; 29 cmISBN:- 0-87942-267-X
- TK7870.15 .M85 1991
Item type | Current library | Collection | Call number | Copy number | Status | Date due | Barcode | |
---|---|---|---|---|---|---|---|---|
Books | Informatics and Virtual Education Library Collection General Collection | Non-fiction | TK7870.15 .M85 1991 (Browse shelf(Opens below)) | C.1 | Available | 7628 |
Browsing Informatics and Virtual Education Library Collection shelves, Shelving location: General Collection, Collection: Non-fiction Close shelf browser (Hides shelf browser)
TK 7870 .M39 1996 Electronic components : selection and application guidelines / | TK 7870 .M45 1991 Microsensors / | TK7870 .S35 1990 Electrostatic discharge protection for electronics / | TK7870.15 .M85 1991 Multichip modules: systems advantages, major constructions, and materials technologies / | TK7870.15 .S65 1993 Soldering processes and equipment / | TK7870.25 .I53 1999 Liquid cooling of electronic devices by single-phase convection / | TK7870.25 .S74 1991 Cooling techniques for electronic equipment / |
Includes bibliographical references and indexes.
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