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1.
Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon. by Series: Electronic packaging and interconnection series
Edition: 2nd ed.
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: New York : McGraw-Hill, c1997
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Availability: Items available for loan: Informatics and Virtual Education Library Collection (1)Call number: TK7836 .H366 1997.

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2.
Strategic value analysis : a modern approach to systems and data planning / Robert M. Curtice. by
Material type: Text Text; Format: print ; Literary form: Not fiction
Publication details: Englewood Cliffs, N.J. : Prentice-Hall, c1987
Availability: Items available for loan: Informatics and Virtual Education Library Collection (1)Call number: QA76.9.S88 C87 1987.

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