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	1.	Wire bonding in microelectronics : materials, processes, reliability, and yield / George G. Harmon. by Harman, George G Harman, George G. Reliability and yield problems of wire bonding in microelectronics Series: Electronic packaging and interconnection series Edition: 2nd ed. Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c1997 Online access: Publisher description Table of contents Availability: Items available for loan: Informatics and Virtual Education Library Collection (1)Call number: TK7836 .H366 1997. Place hold Add to cart (remove)
	2.	Multichip module technology handbook / Philip E. Garrou, Iwona Turlik. by Garrou, Philip E Turlik, Iwona Series: Electronic packaging and interconnection series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c1998 Online access: Publisher description Table of contents Availability: Items available for loan: Informatics and Virtual Education Library Collection (1)Call number: TK7874 .G372 1998. Place hold Add to cart (remove)
	3.	Surface mount technology for concurrent engineering and manufacturing / Frank Classon. by Classon, Frank Series: Electronic packaging and interconnection series Material type: Text; Format: print ; Literary form: Not fiction Publication details: New York : McGraw-Hill, c1993 Availability: Items available for loan: Informatics and Virtual Education Library Collection (1)Call number: TK7870.15 .C59 1993. Place hold Add to cart (remove)

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